University of Hertfordshire

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Description

Thermal analyses of a fibre multi switch designed by Global Invacom Ltd were carried out in Computational Fluid Dynamics (CFD). Numerical simulations were conducted to study the thermal performance of the switch which is made of six different types of materials and comprises sixty micro-chips. Temperature distributions of internal chips under different ambient temperatures and installation directions are presented in the final report.

Key findings

Not to be disclosed
StatusNot started

ID: 9306894