University of Hertfordshire

From the same journal

By the same authors

Documents

View graph of relations
Original languageEnglish
Number of pages13
Pages (from-to)690-702
JournalApplied Thermal Engineering
Journal publication date25 Apr 2016
Volume99
Early online date3 Feb 2016
DOIs
Publication statusPublished - 25 Apr 2016

Abstract

Phase Change Material Board (PCMB) has been considered as an effective way to improve the thermal comfort in either new or existing buildings. In this work, firstly the optimal melting temperatures of internal and external PCMB are given, and the optimal heat storage capacities are obtained under the idealised circumstance of considering sinusoidal changes of the room and outdoor temperatures during a day. Secondly, to study the potential energy saving from applying a PCMB, a case study of a lightweight office with real environmental conditions is carried out. The air conditioning is switched on in the model to keep the indoor temperature within thermal comfort. Using the daily energy consumption and daily thermal comfort rate as the performance criteria, the effects of major influencing factors including melting temperature, latent heat and thermal conductivity of PCMB are studied parametrically. The results show that both the external and internal PCMB can achieve better performance when the melting temperature is chosen to be slightly higher than the average indoor air temperature. In the summer, the external PCMB has a better performance than the internal PCMB because the external PCMB works not only as a heat storage system whose function is similar to the internal PCMB, but also as a thermal connection between the outdoor and indoor environment due to its thermal insulation function, which reduces the influence of the changing outdoor environment.

Notes

This document is the Accepted Manuscript version of the following article: D. Zhuo, Y. tian, Y. Qu, and Y. K. Chen, ‘Thermal analysis of phase change material board (PCMB) under weather conditions in the summer’, Applied Thermal Engineering, Vol. 99: 690-702, April 2016, doi: https://doi.org/10.1016/j.applthermaleng.2016.01.121. This manuscript version is made available under the CC-BY-NC-ND 4.0 license http://creativecommons.org/licenses/by-nc-nd/4.0/.

ID: 9987481