Copper Electrochemical Deposition in Macroporous Silicon Arrays for Through Silicon Via Applications

Thomas Defforge; Loic Coudron; Gael Gautier; Virginie Grimal; Laurent Ventura; Francois Tran Van

doi:10.1109/IITC.2011.5940336

Copper Electrochemical Deposition in Macroporous Silicon Arrays for Through Silicon Via Applications

Thomas Defforge, Loic Coudron, Gael Gautier, Virginie Grimal, Laurent Ventura, Francois Tran Van

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

The present paper deals with the realization of high conductivity through silicon via from macroporous silicon arrays. The pores were first etched by anodization into a hydrofluoric acid mixture. The high aspect ratio via were then filled by an optimized potentiostatic way involving a specific electrolyte with additives. The copper micro-wires were observed by SEM whereas XRD analysis enabled the determination of copper average grain size.

Original language	English
Title of host publication	Procs 2011 IEEE Int Interconnect Technology Conference and 2011 Materials for Advanced Metallization
Subtitle of host publication	(IITC/MAM)
Publisher	Institute of Electrical and Electronics Engineers (IEEE)
Pages	1-3
Number of pages	3
ISBN (Print)	978-1-4577-0502-1
DOIs	https://doi.org/10.1109/IITC.2011.5940336
Publication status	Published - 2011
Event	IEEE International Interconnect Technology Conference and Materials for Advanced Metallization (IITC/MAM) - Dresden Duration: 8 May 2011 → 12 May 2011

Conference

Conference	IEEE International Interconnect Technology Conference and Materials for Advanced Metallization (IITC/MAM)
City	Dresden
Period	8/05/11 → 12/05/11

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10.1109/IITC.2011.5940336

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Defforge, T., Coudron, L., Gautier, G., Grimal, V., Ventura, L., & Tran Van, F. (2011). Copper Electrochemical Deposition in Macroporous Silicon Arrays for Through Silicon Via Applications. In Procs 2011 IEEE Int Interconnect Technology Conference and 2011 Materials for Advanced Metallization: (IITC/MAM) (pp. 1-3). Institute of Electrical and Electronics Engineers (IEEE). https://doi.org/10.1109/IITC.2011.5940336

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title = "Copper Electrochemical Deposition in Macroporous Silicon Arrays for Through Silicon Via Applications",

abstract = "The present paper deals with the realization of high conductivity through silicon via from macroporous silicon arrays. The pores were first etched by anodization into a hydrofluoric acid mixture. The high aspect ratio via were then filled by an optimized potentiostatic way involving a specific electrolyte with additives. The copper micro-wires were observed by SEM whereas XRD analysis enabled the determination of copper average grain size.",

author = "Thomas Defforge and Loic Coudron and Gael Gautier and Virginie Grimal and Laurent Ventura and {Tran Van}, Francois",

year = "2011",

doi = "10.1109/IITC.2011.5940336",

language = "English",

isbn = "978-1-4577-0502-1",

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booktitle = "Procs 2011 IEEE Int Interconnect Technology Conference and 2011 Materials for Advanced Metallization",

publisher = "Institute of Electrical and Electronics Engineers (IEEE)",

address = "United States",

note = "IEEE International Interconnect Technology Conference and Materials for Advanced Metallization (IITC/MAM) ; Conference date: 08-05-2011 Through 12-05-2011",

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Defforge, T, Coudron, L, Gautier, G, Grimal, V, Ventura, L & Tran Van, F 2011, Copper Electrochemical Deposition in Macroporous Silicon Arrays for Through Silicon Via Applications. in Procs 2011 IEEE Int Interconnect Technology Conference and 2011 Materials for Advanced Metallization: (IITC/MAM). Institute of Electrical and Electronics Engineers (IEEE), pp. 1-3, IEEE International Interconnect Technology Conference and Materials for Advanced Metallization (IITC/MAM), Dresden, 8/05/11. https://doi.org/10.1109/IITC.2011.5940336

Copper Electrochemical Deposition in Macroporous Silicon Arrays for Through Silicon Via Applications. / Defforge, Thomas; Coudron, Loic; Gautier, Gael et al.
Procs 2011 IEEE Int Interconnect Technology Conference and 2011 Materials for Advanced Metallization: (IITC/MAM). Institute of Electrical and Electronics Engineers (IEEE), 2011. p. 1-3.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Copper Electrochemical Deposition in Macroporous Silicon Arrays for Through Silicon Via Applications

AU - Defforge, Thomas

AU - Coudron, Loic

AU - Gautier, Gael

AU - Grimal, Virginie

AU - Ventura, Laurent

AU - Tran Van, Francois

PY - 2011

Y1 - 2011

N2 - The present paper deals with the realization of high conductivity through silicon via from macroporous silicon arrays. The pores were first etched by anodization into a hydrofluoric acid mixture. The high aspect ratio via were then filled by an optimized potentiostatic way involving a specific electrolyte with additives. The copper micro-wires were observed by SEM whereas XRD analysis enabled the determination of copper average grain size.

AB - The present paper deals with the realization of high conductivity through silicon via from macroporous silicon arrays. The pores were first etched by anodization into a hydrofluoric acid mixture. The high aspect ratio via were then filled by an optimized potentiostatic way involving a specific electrolyte with additives. The copper micro-wires were observed by SEM whereas XRD analysis enabled the determination of copper average grain size.

U2 - 10.1109/IITC.2011.5940336

DO - 10.1109/IITC.2011.5940336

M3 - Conference contribution

SN - 978-1-4577-0502-1

SP - 1

EP - 3

BT - Procs 2011 IEEE Int Interconnect Technology Conference and 2011 Materials for Advanced Metallization

PB - Institute of Electrical and Electronics Engineers (IEEE)

T2 - IEEE International Interconnect Technology Conference and Materials for Advanced Metallization (IITC/MAM)

Y2 - 8 May 2011 through 12 May 2011

ER -

Defforge T, Coudron L, Gautier G, Grimal V, Ventura L, Tran Van F. Copper Electrochemical Deposition in Macroporous Silicon Arrays for Through Silicon Via Applications. In Procs 2011 IEEE Int Interconnect Technology Conference and 2011 Materials for Advanced Metallization: (IITC/MAM). Institute of Electrical and Electronics Engineers (IEEE). 2011. p. 1-3 doi: 10.1109/IITC.2011.5940336

Copper Electrochemical Deposition in Macroporous Silicon Arrays for Through Silicon Via Applications

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