Abstract
In this work, an on-chip bandpass filter (BPF) with ultra-wideband, low insertion loss, sharp selectivity and excellent in-band flatness is achieved using a novel design approach based on a quasi-lumped-element method. This approach simply utilizes folded metal strip lines with metal-insulator-metal (MIM) capacitors. To understand the principle of the presented design approach, theoretical analysis is given by means of a simplified equivalent LC-circuit model. Using the analyzed results with a full-wave electromagnetic (EM) simulator to guide the design, a BPF is implemented and fabricated in a standard 0.13-µm (Bi)-CMOS technology. The measurements show that a return loss of better than 10 dB is obtained from 13.5 to 32 GHz. Furthermore, the insertion loss of less than 2.3 dB is achieved with less than 0.1 dB in-band magnitude ripple. The BPF size without measurement pads is only 0.148 mm2 (0.37 × 0.4 mm2).
| Original language | English |
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| Title of host publication | 2019 IEEE International Symposium on Circuits and Systems, ISCAS 2019 - Proceedings |
| Publisher | Institute of Electrical and Electronics Engineers (IEEE) |
| Number of pages | 4 |
| Volume | 2019-May |
| ISBN (Print) | 9781728103976 |
| DOIs | |
| Publication status | Published - 1 May 2019 |
| Event | 2019 IEEE International Symposium on Circuits and Systems, ISCAS 2019 - Sapporo, Japan Duration: 26 May 2019 → 29 May 2019 |
Conference
| Conference | 2019 IEEE International Symposium on Circuits and Systems, ISCAS 2019 |
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| Country/Territory | Japan |
| City | Sapporo |
| Period | 26/05/19 → 29/05/19 |