Effects of Reflow Profile and Miniaturisation on the Integrity of Solder Joints in Surface Mount Chip Resistors

Jude E. Njoku, Emeka H. Amalu, Ndy Ekere, Sabuj Mallik, Mathias Ekpu, Eugene A. Ogbodo

Research output: Contribution to journal › Article › peer-review

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Keyphrases

Engineering

Material Science