Abstract
The escalating power density in electronic devices demands effective and sustainable heat dissipation solutions. Micro pin-fin designs offer potential enhancements to thermal management in electronic cooling. Consequently, this short paper numerically investigates heat transfer and flow characteristics in micro pin-fin heating under distinct wall heating conditions. The results indicate that the new scutoid design exhibits a commendable heat transfer coefficient of 3298 W/m²K, with the lowest pressure drop and operating base temperatures. Thus, the findings provide a foundation for future designs and efficient heat transfer strategies.
| Original language | English |
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| Title of host publication | Proceedings of the 9th World Congress on Momentum, Heat and Mass Transfer (MHMT'24) |
| Publication status | Accepted/In press - 30 Jan 2024 |
| Event | 9th World Congress on Momentum, Heat and Mass Transfer (MHMT 2024) - Imperial College London Conference Center, London, United Kingdom Duration: 11 Apr 2024 → 13 Apr 2024 Conference number: 9 https://mhmtcongress.com/ |
Conference
| Conference | 9th World Congress on Momentum, Heat and Mass Transfer (MHMT 2024) |
|---|---|
| Abbreviated title | MHMT 2024 |
| Country/Territory | United Kingdom |
| City | London |
| Period | 11/04/24 → 13/04/24 |
| Internet address |