Investigating Heat Transfer and Flow Characteristics under Different Wall Heating Conditions in Novel Micro Pin-Fin Heat Sinks

Mohammad Harris; Hongwei Wu; Jianfei Sun

doi:10.11159/enfht24.328

Investigating Heat Transfer and Flow Characteristics under Different Wall Heating Conditions in Novel Micro Pin-Fin Heat Sinks

Mohammad Harris
, Hongwei Wu
, Jianfei Sun

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Citations (Scopus)

9 Downloads (Pure)

Abstract

The escalating power density in electronic devices demands effective and sustainable heat dissipation solutions. Micro pin-fin designs offer potential enhancements to thermal management in electronic cooling. Consequently, this short paper numerically investigates heat transfer and flow characteristics in micro pin-fin heating under distinct wall heating conditions. The results indicate that the new scutoid design exhibits a commendable heat transfer coefficient of 3298 W/m²K, with the lowest pressure drop and operating base temperatures. Thus, the findings provide a foundation for future designs and efficient heat transfer strategies.

Original language	English
Title of host publication	Proceedings of the 9th World Congress on Momentum, Heat and Mass Transfer (MHMT'24)
Editors	Lixin Cheng, Tassos G. Karayiannis, Sohel Murshed
Publisher	Avestia Publishing
Pages	1-4
Number of pages	4
ISBN (Print)	9781990800344
DOIs	https://doi.org/10.11159/enfht24.328
Publication status	Published - 13 Apr 2024
Event	9th World Congress on Momentum, Heat and Mass Transfer (MHMT 2024) - Imperial College London Conference Center, London, United Kingdom Duration: 11 Apr 2024 → 13 Apr 2024 Conference number: 9 https://mhmtcongress.com/

Publication series

Name	Proceedings of the World Congress on Momentum, Heat and Mass Transfer
Publisher	Avestia Publishing
ISSN (Electronic)	2371-5316

Conference

Conference	9th World Congress on Momentum, Heat and Mass Transfer (MHMT 2024)
Abbreviated title	MHMT 2024
Country/Territory	United Kingdom
City	London
Period	11/04/24 → 13/04/24
Internet address	https://mhmtcongress.com/

Keywords

CFD
heat sinks
heat transfer
micro pin-fins
microchannels.`
thermal management

Access to Document

10.11159/enfht24.328Licence: Unspecified

Accepted_Manuscript
© 2024, Avestia Publishing. All rights reserved. This is the accepted manuscript version of a conference paper which has been published in final form at https://doi.org/10.11159/enfht24.328
Accepted author manuscript, 668 KBLicence: Unspecified

Cite this

Harris, M., Wu, H., & Sun, J. (2024). Investigating Heat Transfer and Flow Characteristics under Different Wall Heating Conditions in Novel Micro Pin-Fin Heat Sinks. In L. Cheng, T. G. Karayiannis, & S. Murshed (Eds.), Proceedings of the 9th World Congress on Momentum, Heat and Mass Transfer (MHMT'24) (pp. 1-4). Article 328 (Proceedings of the World Congress on Momentum, Heat and Mass Transfer). Avestia Publishing. https://doi.org/10.11159/enfht24.328

Harris, Mohammad ; Wu, Hongwei ; Sun, Jianfei. / Investigating Heat Transfer and Flow Characteristics under Different Wall Heating Conditions in Novel Micro Pin-Fin Heat Sinks. Proceedings of the 9th World Congress on Momentum, Heat and Mass Transfer (MHMT'24) . editor / Lixin Cheng ; Tassos G. Karayiannis ; Sohel Murshed. Avestia Publishing, 2024. pp. 1-4 (Proceedings of the World Congress on Momentum, Heat and Mass Transfer).

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title = "Investigating Heat Transfer and Flow Characteristics under Different Wall Heating Conditions in Novel Micro Pin-Fin Heat Sinks",

abstract = "The escalating power density in electronic devices demands effective and sustainable heat dissipation solutions. Micro pin-fin designs offer potential enhancements to thermal management in electronic cooling. Consequently, this short paper numerically investigates heat transfer and flow characteristics in micro pin-fin heating under distinct wall heating conditions. The results indicate that the new scutoid design exhibits a commendable heat transfer coefficient of 3298 W/m²K, with the lowest pressure drop and operating base temperatures. Thus, the findings provide a foundation for future designs and efficient heat transfer strategies.",

keywords = "CFD, heat sinks, heat transfer, micro pin-fins, microchannels.`, thermal management",

author = "Mohammad Harris and Hongwei Wu and Jianfei Sun",

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doi = "10.11159/enfht24.328",

language = "English",

isbn = "9781990800344",

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}

Harris, M , Wu, H & Sun, J 2024, Investigating Heat Transfer and Flow Characteristics under Different Wall Heating Conditions in Novel Micro Pin-Fin Heat Sinks. in L Cheng, TG Karayiannis & S Murshed (eds), Proceedings of the 9th World Congress on Momentum, Heat and Mass Transfer (MHMT'24) ., 328, Proceedings of the World Congress on Momentum, Heat and Mass Transfer, Avestia Publishing, pp. 1-4, 9th World Congress on Momentum, Heat and Mass Transfer (MHMT 2024), London, United Kingdom, 11/04/24. https://doi.org/10.11159/enfht24.328

Investigating Heat Transfer and Flow Characteristics under Different Wall Heating Conditions in Novel Micro Pin-Fin Heat Sinks. / Harris, Mohammad ; Wu, Hongwei; Sun, Jianfei.
Proceedings of the 9th World Congress on Momentum, Heat and Mass Transfer (MHMT'24) . ed. / Lixin Cheng; Tassos G. Karayiannis; Sohel Murshed. Avestia Publishing, 2024. p. 1-4 328 (Proceedings of the World Congress on Momentum, Heat and Mass Transfer).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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T1 - Investigating Heat Transfer and Flow Characteristics under Different Wall Heating Conditions in Novel Micro Pin-Fin Heat Sinks

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AU - Wu, Hongwei

AU - Sun, Jianfei

N1 - Conference code: 9

PY - 2024/4/13

Y1 - 2024/4/13

N2 - The escalating power density in electronic devices demands effective and sustainable heat dissipation solutions. Micro pin-fin designs offer potential enhancements to thermal management in electronic cooling. Consequently, this short paper numerically investigates heat transfer and flow characteristics in micro pin-fin heating under distinct wall heating conditions. The results indicate that the new scutoid design exhibits a commendable heat transfer coefficient of 3298 W/m²K, with the lowest pressure drop and operating base temperatures. Thus, the findings provide a foundation for future designs and efficient heat transfer strategies.

AB - The escalating power density in electronic devices demands effective and sustainable heat dissipation solutions. Micro pin-fin designs offer potential enhancements to thermal management in electronic cooling. Consequently, this short paper numerically investigates heat transfer and flow characteristics in micro pin-fin heating under distinct wall heating conditions. The results indicate that the new scutoid design exhibits a commendable heat transfer coefficient of 3298 W/m²K, with the lowest pressure drop and operating base temperatures. Thus, the findings provide a foundation for future designs and efficient heat transfer strategies.

KW - CFD

KW - heat sinks

KW - heat transfer

KW - micro pin-fins

KW - microchannels.`

KW - thermal management

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DO - 10.11159/enfht24.328

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BT - Proceedings of the 9th World Congress on Momentum, Heat and Mass Transfer (MHMT'24)

A2 - Cheng, Lixin

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PB - Avestia Publishing

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ER -

Harris M , Wu H, Sun J. Investigating Heat Transfer and Flow Characteristics under Different Wall Heating Conditions in Novel Micro Pin-Fin Heat Sinks. In Cheng L, Karayiannis TG, Murshed S, editors, Proceedings of the 9th World Congress on Momentum, Heat and Mass Transfer (MHMT'24) . Avestia Publishing. 2024. p. 1-4. 328. (Proceedings of the World Congress on Momentum, Heat and Mass Transfer). doi: 10.11159/enfht24.328

Investigating Heat Transfer and Flow Characteristics under Different Wall Heating Conditions in Novel Micro Pin-Fin Heat Sinks

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Keywords

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