Abstract
This paper introduces a unique approach for the implementation of a miniaturized on-chip resonator and its application for the first-order bandpass filter (BPF) design. This approach utilizes a combination of a broadside-coupling technique and a split-ring structure. To fully understand the principle behind it, simplified LC equivalent-circuit models are provided. By analyzing these models, guidelines for implementation of an ultra-compact resonator and a BPF are given. To further demonstrate the feasibility of using this approach in practice, both the implemented resonator and the filter are fabricated in a standard 0.13-μm (Bi)-CMOS technology. The measured results show that the resonator can generate a resonance at 66.75 GHz, while the BPF has a center frequency at 40 GHz and an insertion loss of 1.7 dB. The chip size of both the resonator and the BPF, excluding the pads, is only 0.012mm 2 (0.08 × 0.144 mm 2).
| Original language | English |
|---|---|
| Pages (from-to) | 4062-4071 |
| Number of pages | 10 |
| Journal | IEEE Transactions on Circuits and Systems I: Regular Papers |
| Volume | 65 |
| Issue number | 12 |
| Early online date | 15 Jun 2018 |
| DOIs | |
| Publication status | Published - 12 Dec 2018 |
Keywords
- Bandpass filter (BPF)
- Bi-CMOS
- RFIC
- microwave
- millimeter-wave
- miniaturization
- on-chip resonator
- silicon-germanium (SiGe)