Performance investigation of a loop heat pipe integrated with thermoelectric cooler under acceleration field

Zhen Fang, Yongqi Xie, Yanmeng Xu, Hongwei Wu, Hongxing Zhang, Longzhu Han

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This paper presents an experimental investigation on a novel dual compensation chamber loop heat pipe (DCCLHP) integrated with thermoelectric cooler (TEC) for improving the overall performance under various acceleration conditions. The operating characteristics of the DCCLHP with and without the assistance of TEC for configurations A and B are analyzed systematically under different acceleration magnitudes and heat loads. The heat load on the evaporator ranged from 25 W to 300 W. The power of the TEC was 10 W. The acceleration magnitude ranged from 5 g to 13 g. Experimental results show that: (i) the application of TEC is proved to improve the operating performance at the heat load not exceeding 150 W under configuration A and 100 W under configuration B; (ii) under configuration B, the increase of the acceleration normally leads to the increase of the operating temperature and the decrease of the thermal conductance. While it shows no obvious effect on the operating performance under configuration A for most cases. The maximum operating temperature and thermal conductance is 56.7 ℃ at 150 W under 13 g for configuration B, while 20.7 W/K at 150 W under 5 g for configuration A; (iii) temperature fluctuation occurs at 100 W under 5 g and 7 g for configuration B, whereas there is no fluctuation under configuration A. The acceleration effect can change the vapor-liquid distribution in the loop and the external loop pressure drop, and further change the operating performance along with the TEC effect. This research provides valuable insight into the influence of TEC on DCCLHP under the acceleration field, which is of great significance for its practical application in mechanical and aerospace engineering.
Original languageEnglish
Article number121476
Number of pages17
JournalInternational Journal of Heat and Mass Transfer
Early online date26 Jun 2021
Publication statusE-pub ahead of print - 26 Jun 2021


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