Phase Change Material Applications in Thermal Management of Electronics and Electrical Systems

Tehmina Ambreen, Arslan Saleem, Paula Ruiz-Hincapie, Anirudh Kulkarni, Hafiz Muhammad Ali, Cheol Woo Park

Research output: Chapter in Book/Report/Conference proceedingChapter

Abstract

The escalating power densities and shrinking size of electronic devices present formidable challenges in achieving effective thermal management, particularly for high-performance chips. The failure rate of electronic devices exhibits an exponential rise with escalating operating temperatures. The prevailing design trend in modern electronics, characterized by smaller and faster components, engenders elevated power densities, heightened operating temperatures, and compromised performance and longevity of electronic devices. In light of these challenges, researchers have been actively investigating the applicability of phase change materials in electronic cooling. This chapter provides an exposition of these materials as a prospective solution for electronic cooling, with a particular focus on passive and hybrid cooling methodologies. Passive cooling methods include phase change material-enhanced heat sinks, heat pipes, and phase change material-integrated thermal interface materials. Hybrid cooling systems, on the other hand, involve the integration of phase change materials in conjunction with air, liquid, and thermoelectric cooling techniques. These cooling methodologies hold immense promise in augmenting heat dissipation and averting overheating, thereby ensuring the attainment of optimal performance and prolonged lifespan for electronic devices.

Original languageEnglish
Title of host publicationPhase Change Materials for Thermal Energy Management and Storage
Subtitle of host publicationFundamentals and Applications
EditorsHafiz Muhammad Ali
Place of PublicationBoca Raton
PublisherCRC Press
Chapter9
Pages207-230
Number of pages24
Edition1
ISBN (Electronic)9781040047590
ISBN (Print)9781032359939
DOIs
Publication statusPublished - 23 Jul 2024

Keywords

  • Microencapsulated Phase Change Material
  • construction materials
  • electronics cooling
  • heat sinks
  • heat transfer materials
  • photovolatic thermal management
  • thermal management of batteries

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