University of Hertfordshire

By the same authors

Design of ultra-wideband on-chip millimter-wave bandpass filter in 0.13-µm (Bi)-CMOS technology

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Standard

Design of ultra-wideband on-chip millimter-wave bandpass filter in 0.13-µm (Bi)-CMOS technology. / Sun, Feng; Zhu, He; Zhu, Xi; Yang, Yang; Sun, Yichuang; Xue, Quan.

2019 IEEE International Symposium on Circuits and Systems, ISCAS 2019 - Proceedings. Vol. 2019-May Institute of Electrical and Electronics Engineers Inc., 2019. 8702630.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Harvard

Sun, F, Zhu, H, Zhu, X, Yang, Y, Sun, Y & Xue, Q 2019, Design of ultra-wideband on-chip millimter-wave bandpass filter in 0.13-µm (Bi)-CMOS technology. in 2019 IEEE International Symposium on Circuits and Systems, ISCAS 2019 - Proceedings. vol. 2019-May, 8702630, Institute of Electrical and Electronics Engineers Inc., 2019 IEEE International Symposium on Circuits and Systems, ISCAS 2019, Sapporo, Japan, 26/05/19. https://doi.org/10.1109/ISCAS.2019.8702630

APA

Sun, F., Zhu, H., Zhu, X., Yang, Y., Sun, Y., & Xue, Q. (2019). Design of ultra-wideband on-chip millimter-wave bandpass filter in 0.13-µm (Bi)-CMOS technology. In 2019 IEEE International Symposium on Circuits and Systems, ISCAS 2019 - Proceedings (Vol. 2019-May). [8702630] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISCAS.2019.8702630

Vancouver

Sun F, Zhu H, Zhu X, Yang Y, Sun Y, Xue Q. Design of ultra-wideband on-chip millimter-wave bandpass filter in 0.13-µm (Bi)-CMOS technology. In 2019 IEEE International Symposium on Circuits and Systems, ISCAS 2019 - Proceedings. Vol. 2019-May. Institute of Electrical and Electronics Engineers Inc. 2019. 8702630 https://doi.org/10.1109/ISCAS.2019.8702630

Author

Sun, Feng ; Zhu, He ; Zhu, Xi ; Yang, Yang ; Sun, Yichuang ; Xue, Quan. / Design of ultra-wideband on-chip millimter-wave bandpass filter in 0.13-µm (Bi)-CMOS technology. 2019 IEEE International Symposium on Circuits and Systems, ISCAS 2019 - Proceedings. Vol. 2019-May Institute of Electrical and Electronics Engineers Inc., 2019.

Bibtex

@inproceedings{d0b52a2dd2fa4e9fbbf85d0ba00df6f1,
title = "Design of ultra-wideband on-chip millimter-wave bandpass filter in 0.13-µm (Bi)-CMOS technology",
abstract = "In this work, an on-chip bandpass filter (BPF) with ultra-wideband, low insertion loss, sharp selectivity and excellent in-band flatness is achieved using a novel design approach based on a quasi-lumped-element method. This approach simply utilizes folded metal strip lines with metal-insulator-metal (MIM) capacitors. To understand the principle of the presented design approach, theoretical analysis is given by means of a simplified equivalent LC-circuit model. Using the analyzed results with a full-wave electromagnetic (EM) simulator to guide the design, a BPF is implemented and fabricated in a standard 0.13-µm (Bi)-CMOS technology. The measurements show that a return loss of better than 10 dB is obtained from 13.5 to 32 GHz. Furthermore, the insertion loss of less than 2.3 dB is achieved with less than 0.1 dB in-band magnitude ripple. The BPF size without measurement pads is only 0.148 mm2 (0.37 × 0.4 mm2).",
author = "Feng Sun and He Zhu and Xi Zhu and Yang Yang and Yichuang Sun and Quan Xue",
year = "2019",
month = may,
day = "1",
doi = "10.1109/ISCAS.2019.8702630",
language = "English",
isbn = "9781728103976",
volume = "2019-May",
booktitle = "2019 IEEE International Symposium on Circuits and Systems, ISCAS 2019 - Proceedings",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
address = "United States",
note = "2019 IEEE International Symposium on Circuits and Systems, ISCAS 2019 ; Conference date: 26-05-2019 Through 29-05-2019",

}

RIS

TY - GEN

T1 - Design of ultra-wideband on-chip millimter-wave bandpass filter in 0.13-µm (Bi)-CMOS technology

AU - Sun, Feng

AU - Zhu, He

AU - Zhu, Xi

AU - Yang, Yang

AU - Sun, Yichuang

AU - Xue, Quan

PY - 2019/5/1

Y1 - 2019/5/1

N2 - In this work, an on-chip bandpass filter (BPF) with ultra-wideband, low insertion loss, sharp selectivity and excellent in-band flatness is achieved using a novel design approach based on a quasi-lumped-element method. This approach simply utilizes folded metal strip lines with metal-insulator-metal (MIM) capacitors. To understand the principle of the presented design approach, theoretical analysis is given by means of a simplified equivalent LC-circuit model. Using the analyzed results with a full-wave electromagnetic (EM) simulator to guide the design, a BPF is implemented and fabricated in a standard 0.13-µm (Bi)-CMOS technology. The measurements show that a return loss of better than 10 dB is obtained from 13.5 to 32 GHz. Furthermore, the insertion loss of less than 2.3 dB is achieved with less than 0.1 dB in-band magnitude ripple. The BPF size without measurement pads is only 0.148 mm2 (0.37 × 0.4 mm2).

AB - In this work, an on-chip bandpass filter (BPF) with ultra-wideband, low insertion loss, sharp selectivity and excellent in-band flatness is achieved using a novel design approach based on a quasi-lumped-element method. This approach simply utilizes folded metal strip lines with metal-insulator-metal (MIM) capacitors. To understand the principle of the presented design approach, theoretical analysis is given by means of a simplified equivalent LC-circuit model. Using the analyzed results with a full-wave electromagnetic (EM) simulator to guide the design, a BPF is implemented and fabricated in a standard 0.13-µm (Bi)-CMOS technology. The measurements show that a return loss of better than 10 dB is obtained from 13.5 to 32 GHz. Furthermore, the insertion loss of less than 2.3 dB is achieved with less than 0.1 dB in-band magnitude ripple. The BPF size without measurement pads is only 0.148 mm2 (0.37 × 0.4 mm2).

UR - http://www.scopus.com/inward/record.url?scp=85066795187&partnerID=8YFLogxK

U2 - 10.1109/ISCAS.2019.8702630

DO - 10.1109/ISCAS.2019.8702630

M3 - Conference contribution

AN - SCOPUS:85066795187

SN - 9781728103976

VL - 2019-May

BT - 2019 IEEE International Symposium on Circuits and Systems, ISCAS 2019 - Proceedings

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2019 IEEE International Symposium on Circuits and Systems, ISCAS 2019

Y2 - 26 May 2019 through 29 May 2019

ER -